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  5116-7776M Datasheet PDF File

For 5116-7776M Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

    0511640305 51164-0305

Molex Electronics Ltd.
Part No. 0511640305 51164-0305
Description 2.50mm (.098) Wire-to-Board Retainer, 3 circuits
2.50mm (.098") Wire-to-Board Retainer, 3 circuits

File Size 89.82K  /  2 Page

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Amphenol Communications Solutions

Part No. 95615-116LF
Description Minitek® 2.00mm, Board to Board, Shrouded Vertical Header- Through Mount - Double row - 16 Positions - 2.00mm (0.079in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0521511610

Molex Electronics Ltd.
Part No. 0521511610
Description 2.00mm (.079") Pitch Wire Trap, Pull-Cover Style, Right Angle, 16 Circuits

File Size 113.85K  /  3 Page

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Amphenol Communications Solutions

Part No. 69155-116LF
Description Quickie Slimline Header, Wire to Board connector, Through Hole, Right Angle, Double Row, 16 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    NIEC[Nihon Inter Electronics Corporation]
Part No. PDT15116 PDH15116
Description THYRISTOR MODULE 150A / 1600V

File Size 322.11K  /  9 Page

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Amphenol Communications Solutions

Part No. 69155-116
Description Quickie Slimline Header, Through Hole, Double Row, 16 Positions, 2.54 mm (0.1 in.), Right Angle Header 0.76 um (30 u\\.) GXT™ Mating Plating
Tech specs    

Official Product Page

    0511640605 51164-0605

Molex Electronics Ltd.
Part No. 0511640605 51164-0605
Description 2.50mm (.098") Wire-to-Board Retainer, 6 circuits
2.50mm (.098) Wire-to-Board Retainer, 6 circuits

File Size 89.65K  /  2 Page

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Amphenol Communications Solutions

Part No. 87185-116HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 16 Positions, 2.54 mm Pitch, Vertical, 26.49 mm (1.043in) Mating, 2.41 mm (0.095in) Tail.
Tech specs    

Official Product Page

    0554511670 55451-1670

Molex Electronics Ltd.
Part No. 0554511670 55451-1670
Description 1.25mm (.049) Pitch Mi ll?/a> System Wire-to-Board Header, Dual Row, Vertical, LeadfreeLeadfree,

File Size 121.07K  /  3 Page

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Amphenol Communications Solutions

Part No. 79425-116HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Double Row, 16 Positions, 2.54 mm Pitch, Vertical, 4.83 mm (0.19 in.) Mating, 3.05 mm (0.12 in.) Tail.
Tech specs    

Official Product Page

    K4H511638F

Samsung semiconductor
Part No. K4H511638F
Description 512Mb F-die DDR SDRAM Specification

File Size 397.07K  /  24 Page

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Amphenol Communications Solutions

Part No. 131-5116-21D
Description Paladin® 112Gb/s Backplane Connector, 5-Pair, 6 Column, Open Wall, Backplane Module, 2.25mm Wipe, Nickel Sulfamate.
Tech specs    

Official Product Page

    K4H511638G

Samsung semiconductor
Part No. K4H511638G
Description 512Mb G-die DDR SDRAM Specification

File Size 394.04K  /  24 Page

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Amphenol Communications Solutions

Part No. 88951-161PLF
Description 4 Row Signal Header,24 position Straight, Solder-to-Board, Wide body
Tech specs    

Official Product Page

    51163-0600 0511630600

Molex Electronics Ltd.
Part No. 51163-0600 0511630600
Description 2.50mm (.098) Pitch Wire-to-Board Receptacle Housing, Positive Lock, With Retainer6 Circuits
2.50mm (.098") Pitch Wire-to-Board Receptacle Housing, Positive Lock, With Retainer6 Circuits

File Size 280.27K  /  5 Page

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Amphenol Communications Solutions

Part No. 88951-161LF
Description Metral® Board Connectors, Backplane Connectors, 4 Row Signal Header, Straight, Solder-to-Board, Wide body.
Tech specs    

Official Product Page

   
Part No. HM511664LJ-10
Description x16 Fast Page Mode DRAM

File Size 1,179.95K  /  30 Page

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Amphenol Communications Solutions

Part No. 68015-116HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 16 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

    K4X51163PE-L

Samsung semiconductor
Part No. K4X51163PE-L
Description 32Mx16 Mobile DDR SDRAM

File Size 307.93K  /  20 Page

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Amphenol Communications Solutions

Part No. 68705-116HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Single Row, 16 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

For 5116-7776M Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |   

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