2020-1300 pdf Datasheet P11 Part Num --- IC-ON-LINE


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2020-1300 Datasheet PDF File

For 2020-1300 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |

					EPIGAP optoelectronic GmbH
Part No.	EPD-1300-0-0.5
Description	Photodiode
File Size	44.47K / 2 Page	View it Online	Download Datasheet

						Toshiba Electronic Devices & Storage Corporation
Part No.	XPN1300ANC
Description	N-ch MOSFET, 100 V, 30 A, 0.0133 Ω@10V, TSON Advance(WF)
Tech specs				Official Product Page

HUA FENG CIRCUIT

					EPIGAP optoelectronic GmbH
Part No.	EPC-1300-0.5-4
Description	Photodiode-Chip
File Size	122.82K / 2 Page	View it Online	Download Datasheet

						Rochester Electronics LLC
Part No.	BLA1011-300
Description	BLA1011-300 - 300W LDMOS Avionics Power Transistor
Tech specs				Official Product Page

					EPIGAP optoelectronic GmbH
Part No.	EPC-1300-0.5-3
Description	Photodiode-Chip
File Size	121.96K / 2 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10106262-0202001LF
Description	PwrBlade+® , Power Connectors, 2LP+8S STB, Right Angle, Header.
Tech specs				Official Product Page

					EPIGAP optoelectronic GmbH
Part No.	EPC-1300-0.5-2
Description	Photodiode-Chip
File Size	122.90K / 2 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54122-520202050LF
Description	BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking Header, Through Hole, Double Row, 20 Positions
Tech specs				Official Product Page

					EPIGAP optoelectronic GmbH
Part No.	EPC-1300-0.5-1
Description	Photodiode-Chip
File Size	121.73K / 2 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54112-801300800LF
Description	BERGSTIK STACKING
Tech specs				Official Product Page

					EPIGAP optoelectronic GmbH
Part No.	EPC-1300-0.22-4
Description	Photodiode-Chip
File Size	121.80K / 2 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	92813-007LF
Description	Minitek® 2.00mm, Board to Board, Unshrouded Vertical Stacking Header, Surface Mount, Double Row, 40 Positions, 2.00mm (0.079in) Pitch..
Tech specs				Official Product Page

					EPIGAP optoelectronic GmbH
Part No.	EPC-1300-0.22-3
Description	Photodiode-Chip
File Size	121.53K / 2 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	92813-005LF
Description	Minitek® 2.00mm, Board to Board, Unshrouded Vertical Stacking Header, Surface Mount, Double Row, 16 Positions, 2.00mm (0.079in) Pitch..
Tech specs				Official Product Page

					EPIGAP optoelectronic GmbH
Part No.	EPC-1300-0.22-2
Description	Photodiode-Chip
File Size	122.66K / 2 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	10061913-003CLF
Description	PCI Express® GEN 3 Card Edge, Storage and Server Connector, Vertical, Surface Mount, x16, 164 Positions, 1.00mm (0.039in) Pitch
Tech specs				Official Product Page

					EPIGAP optoelectronic GmbH
Part No.	EPC-1300-0.22-1
Description	Photodiode-Chip
File Size	121.66K / 2 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54121-112021300LF
Description	BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 2 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

					EPIGAP optoelectronic GmbH
Part No.	EPC-1300-1.0-4
Description	Photodiode-Chip
File Size	122.52K / 2 Page	View it Online	Download Datasheet

						Amphenol Communications Solutions
Part No.	54121-407031300LF
Description	BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 3 Positions, 2.54mm (0.100in) Pitch.
Tech specs				Official Product Page

For 2020-1300 Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | <11> | 12 | 13 | 14 | 15 |

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