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Infineon Technologies AG
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| Part No. |
BTS244Z09 BTS244ZE-3043 BTS244ZE-3062A
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| OCR Text |
...matic category; DIN IEC 68-1
1current limited by bond wire 2Note: Thermal trip temperature of temperature sensor is below 175C
Data Sheet 2 Rev.1.3, 2009-12-04
Speed TEMPFET BTS244Z
Thermal Characteristics Parameter Characteristi... |
| Description |
Speed TEMPFET
35 A, 55 V, 0.018 ohm, N-CHANNEL, Si, POWER, MOSFET GREEN, PLASTIC, TO-220, 5 PIN
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| File Size |
395.43K /
14 Page |
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it Online |
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Infineon Technologies
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| Part No. |
07N60S5
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| OCR Text |
...) 3.5 4.5 5.5 V(BR)DSS 600 V
1current limited by T jmax 2 Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6 cm (one layer, 70m thick) copper area for drain connection. PCB is vertical without blown air.
2
2002-07-26
www.DataSheet.in
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| Description |
Search --To SPI07N60S5
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| File Size |
128.23K /
10 Page |
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it Online |
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Infineon Technologies
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| Part No. |
20N03L
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| OCR Text |
...
RDS(on)
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15.5
20
1current limited by bondwire ; with an RthJC = 2.5K/W the chip is able to carry I D= 42A at 25C, for detailed information see app.-note ANPS071E available at www.infineon.com/optimos 2Defined by design. Not s... |
| Description |
Search --To IPD20N03L
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| File Size |
195.20K /
8 Page |
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it Online |
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Infineon Technologies
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| Part No. |
20N60S5
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| OCR Text |
...) 3.5 4.5 5.5 V(BR)DSS 600 V
1current limited by T jmax 2 Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6 cm (one layer, 70m thick) copper area for drain connection. PCB is vertical without blown air.
2
2001-07-25
www.DataSheet4U.... |
| Description |
Search --To SPP20N60S5
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| File Size |
154.76K /
9 Page |
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it Online |
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