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  TIM-5510 Datasheet PDF File

For TIM-5510 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |   

    TOSHIBA[Toshiba Semiconductor]
Part No. TIM1314-30L
Description MICROWAVE POWER GaAs FET

File Size 38.03K  /  2 Page

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Amphenol Communications Solutions

Part No. 55101-T1109LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 9 Positions, 2.54 mm Pitch, Right Angle
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Toshiba Corporation
TOSHIBA[Toshiba Semiconductor]
Part No. TIM0910-15L
Description MICROWAVE POWER GAAS FET
From old datasheet system

File Size 130.04K  /  4 Page

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Amphenol Communications Solutions

Part No. 55102-G1110LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 20 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    TIM5053-4SL

Toshiba Semiconductor
Part No. TIM5053-4SL
Description MICROWAVE POWER GaAs FET

File Size 365.90K  /  4 Page

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Amphenol Communications Solutions

Part No. 55101-T1108LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 8 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    Toshiba Corporation
Part No. TIM1414-4LA
Description MICROWAVE POWER GaAs FET

File Size 84.76K  /  2 Page

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Amphenol Communications Solutions

Part No. 55101-S3620LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 20 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    TIM6472-6UL

Toshiba Semiconductor
Part No. TIM6472-6UL
Description HIGH POWER P1dB=38.5dBm at 6.4GHz to 7.2GHz

File Size 117.35K  /  4 Page

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Amphenol Communications Solutions

Part No. 55101-G17-04
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 4 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    TIM5964-8UL

Toshiba Semiconductor
Part No. TIM5964-8UL
Description HIGH POWER P1dB=39.5dBm at 5.9GHz to 6.4GHz

File Size 117.42K  /  4 Page

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Amphenol Communications Solutions

Part No. 55101-T1104LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Single Row, 4 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    Toshiba Corporation
Part No. TIM4450-8SL
Description MICROWAVE POWER GaAs FET

File Size 84.43K  /  2 Page

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Amphenol Communications Solutions

Part No. 55101-T1113LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 13 Positions, 2.54 mm Pitch, Right Angle
Tech specs    

Official Product Page

    Toshiba
Part No. TIM1414-7-253
Description Microwave Power GaAs FET

File Size 211.11K  /  1 Page

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Amphenol Communications Solutions

Part No. 55102-G1703LF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 6 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    Toshiba
Part No. TIM1414-15-253
Description Microwave Power GaAs FET

File Size 211.92K  /  1 Page

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Amphenol Communications Solutions

Part No. 55101-S1120LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 20 Positions, 2.54 mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

    TIM7785-8SL

Toshiba Semiconductor
Part No. TIM7785-8SL
Description MICROWAVE POWER GaAs FET

File Size 242.70K  /  4 Page

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Amphenol Communications Solutions

Part No. 55101-T1102LF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 2 Positions, 2.54 mm (0.100in) Pitch, Right Angle
Tech specs    

Official Product Page

For TIM-5510 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |   

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