through-hole micro header pdf Datasheet P10 Description --- IC-ON-LINE


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through-hole micro header Datasheet PDF File

For through-hole micro header Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |

				Molex Electronics Ltd.
Part No.	0430452428-18
Description	micro-Fit 3.0 Vertical header, 3.00mm Pitch, Dual Row, 24 Circuits
File Size	27.85K / 2 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	0850032995 85003-2995
Description	2.54mm (.100) Pitch DIN 41612 header, Style C/2, Right Angle, Through Hole, 0.25μm (10μ) Selective Gold (Au), 32 Circuits 2.54mm (.100") Pitch DIN 41612 header, Style C/2, Right Angle, Through Hole, 0.25渭m (10渭") Selective Gold (Au), 32 Circuits MOLEX Connector
File Size	65.01K / 3 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	0850032751 85003-2751
Description	2.54mm (.100) Pitch DIN 41612 header, Style C Right Angle, Through Hole 2.54mm (.100") Pitch DIN 41612 header, Style C Right Angle, Through Hole MOLEX Connector
File Size	75.18K / 3 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	87914-2216 0879142216
Description	2.54mm (.100) Pitch C-Grid? header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid庐 header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid垄莽 header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
File Size	3,779.50K / 48 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	87914-3616 0879143616
Description	2.54mm (.100) Pitch C-Grid? header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid庐 header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free 2.54mm (.100) Pitch C-Grid垄莽 header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
File Size	3,779.41K / 48 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	0440671001 44067-1001
Description	3.00mm (.118) Pitch micro-Fit 3.0 Wire-to-Board header, Dual Row, Vertical for up to 3.56mm (.140) 3.00mm (.118") Pitch micro-Fit 3.0 Wire-to-Board header, Dual Row, Vertical for up to 3.56mm (.140") MOLEX Connector
File Size	204.09K / 3 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	0440671002 44067-1002
Description	3.00mm (.118) Pitch micro-Fit 3.0 Wire-to-Board header, Dual Row, Vertical for up to 3.56mm (.140) 3.00mm (.118") Pitch micro-Fit 3.0 Wire-to-Board header, Dual Row, Vertical for up to 3.56mm (.140") MOLEX Connector
File Size	204.16K / 3 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	0440671003 44067-1003
Description	3.00mm (.118) Pitch micro-Fit 3.0 Wire-to-Board header, Dual Row, Vertical for up to 3.56mm (.140) 3.00mm (.118") Pitch micro-Fit 3.0 Wire-to-Board header, Dual Row, Vertical for up to 3.56mm (.140") MOLEX Connector
File Size	204.16K / 3 Page	View it Online	Download Datasheet

				Samtec, Inc
Part No.	TMM-102-03-G-S
Description	LOW PROFILE through-hole header
File Size	1,314.30K / 1 Page	View it Online	Download Datasheet

For through-hole micro header Found Datasheets File :: 150+ Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |