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HSMC[Hi-Sincerity Mocroelectronics]
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Part No. |
HMBT9018
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OCR Text |
...aterial: * Lead solder plating: sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
DIM A B C D G H J K L S V
Min. 2.80 1.20 0.89 0.30 1.70 0.013 0.08... |
Description |
NPN EPITAXIAL PLANAR TRANSISTOR
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File Size |
36.45K /
4 Page |
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HSMC[Hi-Sincerity Mocroelectronics]
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Part No. |
HT117
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OCR Text |
...aterial: * Lead solder plating: sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free) * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
DIM A B C D E F G H I J K L M a1
Min. 3.81 6.99 13.50 7.52 0.95 0.... |
Description |
PNP EPITAXIAL PLANAR TRANSISTOR
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File Size |
43.39K /
4 Page |
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it Online |
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VECTRON[Vectron International, Inc]
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Part No. |
TFS71D
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OCR Text |
... test method 1; soft solder L - sn60 Pb40; 235 C / 2 sec.; Flux is Kolophonium 25 % and Propanol 75 % or Ethanol 75 %; Preconditioning is aging according to IEC 68 - 2 - 30; 95 % rel. humidity; +25 C / +55 C within 12 + 12-hour cycle; 6 day... |
Description |
Specification
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File Size |
29.31K /
3 Page |
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HB[HB Electronic Components]
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Part No. |
0603LWCT
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OCR Text |
...sipation of iron : 20W Max. use sn60 solder of solder with silver content and don't to touch LED lens when soldering. Wave soldering : Pre-heat 100C Max, Pre-heat time 60 sec. Max, Solder wave 260C Max, Soldering time 5 sec. Max. performed ... |
Description |
SURFACE MOUNT DEVICE LED
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File Size |
690.72K /
10 Page |
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it Online |
Download Datasheet
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HB Electronic Component... HB[HB Electronic Components]
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Part No. |
0603LGCT
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OCR Text |
...sipation of iron : 20W Max. use sn60 solder of solder with silver content and don't to touch LED lens when soldering.
DRAWING NO. : DS-74-03-0008
DATE : 2004-06-07
PAGE 8 of 10
SURFACE MOUNT DEVICE LED Part No. : 0603LGCT
REV:A... |
Description |
SURFACE MOUNT DEVICE LED
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File Size |
789.47K /
10 Page |
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it Online |
Download Datasheet
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Price and Availability
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