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perimeter Datasheet PDF File

For perimeter Found Datasheets File :: 883 Search Time::1.844ms
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				XILINX[Xilinx, Inc]
Part No.	XC2S100-5TQ144I XC2S150-5FG456C XC2S50 XC2S15-5VQ100I XC2S100 XC2S100-5FG456C XC2S100-5FG456I XC2S100-5PQ208C XC2S100-5TQ144C XC2S100-5VQ100I XC2S100-6CS144I XC2S100-6FG256I XC2S100-6FG456C XC2S100-6TQ144C XC2S100-6VQ100C XC2S100-6VQ100I XC2S200 XC2S30-5PQ208C XC2S50-6TQ144C XC2S50-6TQ144I XC2S150-5PQ208C XC2S150-5FG256C XC2S200-5FG256I XC2S200-5FG456C XC2S200-5VQ100C XC2S50-5FG456C XC2S50-5PQ208C XC2S50-5PQ208I XC2S15-5TQ144I XC2S30-5TQ144C XC2S50-6PQ208C XC2S100-5CS144C XC2S100-5CS144I XC2S100-5FG256C XC2S100-5FG256I XC2S100-5PQ208I XC2S100-5VQ100C XC2S100-6CS144C XC2S100-6FG256C XC2S100-6FG456I XC2S100-6PQ208C XC2S100-6PQ208I XC2S100-6TQ144I XC2S150 XC2S50-5TQ144C XC2S50-5TQ144I XC2S200-5CS144C XC2S200-5CS144I XC2S200-5FG256C XC2S200-5FG456I XC2S200-5PQ208C XC2S200-5PQ208I XC2S200-5TQ144C XC2S200-5TQ144I XC2S200-5VQ100I XC2S50-5CS144C XC2S50-5CS144I XC2S50-5FG256C XC2S50-5FG256I XC2S50-5FG456I XC2S50-5VQ100C XC2S50-5VQ100I XC2S200-6FG256C XC2S200-6FG256I XC2S200-6FG456C XC2S200-6FG456I XC2S15-5TQ144C XC2S150-5PQ208I XC2S150-6FG456C XC2S150-6FG456I XC2S30-5TQ144I XC2S30-5VQ100C XC2S30-5VQ100I XC2S50-6FG256C XC2S50-6FG256I XC2S50-6PQ208I XC2S150-5FG256I XC2S50-6VQ100I XC2S15 XC2S1
OCR Text	... Blocks (CLBs), surrounded by a perimeter of programmable Input/Output Blocks (IOBs). There are four Delay-Locked Loops (DLLs), one at each corner of the die. Two columns of block RAM lie on opposite sides of the die, between the CLBs and t...
Description	Streamlined features based on Virtex architecture Spartan-II 2.5V field programmable gate array. SPARTAN-II 2.5V FPGA FAMILY:INTRODUCTION AND ORDERING INFORMATION
File Size	36.08K / 4 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC158
OCR Text	...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 1.0 diameter pure gold wire. Thermosonic wirebonding wiht a nominal ...
Description	GaAs MMIC SMT PASSIVE FREQUENCY DOUBLER/ 1.3 - 4.0 GHz INPUT GaAs MMIC SMT PASSIVE FREQUENCY DOUBLER, 1.3 - 4.0 GHz INPUT
File Size	163.50K / 4 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC240
OCR Text	...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding wit...
Description	GaAs MMIC SPDT SWITCH DC - 4.0 GHz
File Size	113.00K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC247
OCR Text	...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025mm (1 mil) diameter pure gold wire. Thermosonic wirebonding wit...
Description	400° ANALOG PHASE SHIFTER 5 - 18 GHz
File Size	308.29K / 6 Page	View it Online	Download Datasheet

				Z-Communications, Inc
Part No.	PCA0300A
OCR Text	...ius of all 14 half holes at the perimeter of the board are plated to provide a surface for the attachment of the PLL Module to the motherboard. 5 pads are for grounding, 8 pads are for signal interface. 2. The surface of the shield is tin-p...
Description	LOW COST - HIGH PERFORMANCE PHASE LOCKED LOOP
File Size	49.46K / 2 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC129
OCR Text	...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire. Thermosonic wirebonding wi...
Description	GaAs MMIC DOUBLE-BALANCED MIXER, 4 - 8 GHz
File Size	171.18K / 6 Page	View it Online	Download Datasheet

				HITTITE[Hittite Microwave Corporation]
Part No.	HMC203
OCR Text	...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. 5 MIXERS - CHIP 5 - 31 Wire Bonding RF bonds made with 0.003" x 0.0005" ribbon are recommended. Thes...
Description	GaAs MMIC DOUBLE-BALANCED MIXER/ 14 - 23 GHz GaAs MMIC DOUBLE-BALANCED MIXER 14 - 23 GHz GaAs MMIC DOUBLE-BALANCED MIXER, 14 - 23 GHz
File Size	93.31K / 4 Page	View it Online	Download Datasheet

				ZCOMM[Z-Communications, Inc]
Part No.	PCA0102A
OCR Text	...ius of all 14 half holes at the perimeter of the board are plated to provide a surface for the attachment of the PLL Module to the motherboard. 5 pads are for grounding, 8 pads are for signal interface. 2. The surface of the shield is tin-p...
Description	LOW COST - HIGH PERFORMANCE PHASE LOCKED LOOP
File Size	52.99K / 2 Page	View it Online	Download Datasheet

				XILINX
Part No.	XCS05-3VQ100C XCS20XL
OCR Text	... channels), and surrounded by a perimeter of programmable Input/Output Blocks (IOBs), as seen in Figure 1. They have generous routing resources to accommodate the most complex interconnect patterns. The devices are customized by loading con...
Description	From old datasheet system Spartan and Spartan-XL Families Field Programmable Gate Arrays
File Size	654.75K / 82 Page	View it Online	Download Datasheet

				HITTITE[Hittite Microwave Corporation]
Part No.	HMC205
OCR Text	...y fillet is observed around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer's schedule. Wire Bonding Ball or wedge bond with 1.0 diameter pure gold wire. Thermosonic wirebonding wiht a nominal ...
Description	GaAs MMIC PASSIVE FREQUENCY DOUBLER, 6 - 12 GHz INPUT GaAs MMIC PASSIVE FREQUENCY DOUBLER 6 - 12 GHz INPUT
File Size	180.63K / 6 Page	View it Online	Download Datasheet

For perimeter Found Datasheets File :: 883 Search Time::1.844ms
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