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68HC05B4 100A6 2N2993 C1318A 110000 2C18020 2SA2083 51216
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For gradient Found Datasheets File :: 1376    Search Time::1.344ms    
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    MMSD103T1 MMSD103 MMSD103T1-D

ONSEMI[ON Semiconductor]
Part No. MMSD103T1 MMSD103 MMSD103T1-D
OCR Text ...dering, the maximum temperature gradient shall be 5C or less. * After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will ...
Description High Voltage Switching Diode

File Size 45.80K  /  4 Page

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    PZTA92T1

MOTOROLA[Motorola, Inc]
Part No. PZTA92T1
OCR Text ...g will increase the temperature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cooling * Soldering a device without preheating can cause excessive thermal shock and ...
Description PNP SILICON HIGH VOLTAGE TRANSISTOR SURFACE MOUNT

File Size 58.68K  /  4 Page

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    BC857BWT1 BC857AWT1 BC858BWT1 BC856BWT1 BC858AWT1 BC856AWT1 BC858CWT1

Motorola Mobility Holdings, Inc.
Motorola Inc
MOTOROLA[Motorola Inc]
MOTOROLA[Motorola, Inc]
Part No. BC857BWT1 BC857AWT1 BC858BWT1 BC856BWT1 BC858AWT1 BC856AWT1 BC858CWT1
OCR Text ...dering, the maximum temperature gradient shall be 5C or less. * After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will ...
Description CASE 419-02, STYLE 3 SOT-323/SC-70 100 mA, 45 V, PNP, Si, SMALL SIGNAL TRANSISTOR
CASE 419-02, STYLE 3 SOT-323/SC-70 100 mA, 30 V, PNP, Si, SMALL SIGNAL TRANSISTOR
CASE 419-02/ STYLE 3 SOT-323/SC-70
CASE 419-02 STYLE 3 SOT-323/SC-70

File Size 251.09K  /  8 Page

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    BAS7004LT1

Motorola, Inc.
MOTOROLA[Motorola Inc]
MOTOROLA[Motorola, Inc]
Part No. BAS7004LT1
OCR Text ...dering, the maximum temperature gradient shall be 5C or less. * After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will ...
Description CASE 318-08, STYLE 12 SOT-23 TO-236AB
CASE 318-08 STYLE 12 SOT-23 TO-236AB

File Size 72.79K  /  4 Page

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    BAV99WT1 BAV99RWT1 ON0136 BAV99

ROHM
ON Semi
MOTOROLA[Motorola, Inc]
Part No. BAV99WT1 BAV99RWT1 ON0136 BAV99
OCR Text ...dering, the maximum temperature gradient shall be 5C or less. * After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will ...
Description Diodes > JEDEC Standard & Euro Standard Diodes > Surface mounting type
SC-70/SOT-323 Dual Series Switching Diode
BAV99WT1 CASE 419-2, STYLE 9 SC-0/SOT-23
From old datasheet system

File Size 128.48K  /  6 Page

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    BSP19AT1 BSP20AT1

Motorola Inc
MOTOROLA[Motorola, Inc]
Part No. BSP19AT1 BSP20AT1
OCR Text ...g will increase the temperature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cooling * Soldering a device without preheating can cause excessive thermal shock and ...
Description SOT.223 PACKAGE NPN SILICON HIGH VOLTAGE TRANSISTOR SURFACE MOUNT

File Size 119.13K  /  6 Page

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    MMBD2005T1 MMBD3005T1 MMBD1005LT1

MOTOROLA[Motorola, Inc]
Part No. MMBD2005T1 MMBD3005T1 MMBD1005LT1
OCR Text ...g will increase the temperature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cooling * Soldering a device without preheating can cause excessive thermal shock and ...
Description Switching Diode

File Size 159.99K  /  8 Page

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