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  glass ceramic Datasheet PDF File

For glass ceramic Found Datasheets File :: 3351    Search Time::1.734ms    
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    CMS14 CMS1406

Toshiba Semiconductor
Part No. CMS14 CMS1406
OCR Text ...) Rth (j-a) Device mounted on a glass-epoxy board (board size: 50 mm x 50 mm) (soldering land: 6 mm x 6 mm) (board thickness: 1.6 t) Device ...ceramic board: Rectangular board size: 50 mm x 50 mm waveform soldering land: 2 mm x 2 mm board thic...
Description Switching Mode Power Supply Applications

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    CMS1106

Toshiba Semiconductor
Part No. CMS1106
OCR Text ...e Rth (j-a) Device mounted on a glass-epoxy board (soldering land: 6 mm x 6 mm) Min Typ. 0.38 0.42 0.49 2.0 20.0 95 Max 0.55 ...ceramic board (board size: 50 mm x 50 mm) 160 Rectangular waveform 160 T max - IF (AV) Maximum ...
Description Switching Mode Power Supply Applications

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    ILX535 ILX535K

SONY[Sony Corporation]
Part No. ILX535 ILX535K
OCR Text ...side the outer perimeter of the glass portion.) (2) Shearing strength: 29N/surface (3) Tensile strength: 29N/surface (4) Torsional strength:...ceramic portion Adhesive (1) (2) (3) (4) , , , , , , , , , , , , b) In ...
Description 5300 pixel X 3 line CCD Linear Sensor (Color)

File Size 130.27K  /  11 Page

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    L6301 L6565 L7307 L2D2 L6302 L6303 L6304 L6305 L6306 L6307 L6308 L6309 L6310 L6311 L6311-50 L6312 L6312-50 L6566 L6999 L

Hamamatsu Photonics K.K.
HAMAMATSU[Hamamatsu Corporation]
Part No. L6301 L6565 L7307 L2D2 L6302 L6303 L6304 L6305 L6306 L6307 L6308 L6309 L6310 L6311 L6311-50 L6312 L6312-50 L6566 L6999 L6999-50 L7174 L7292 L7293 L7295 L7296 L7296-50 L7298 L7306
OCR Text ....0 1.0 1.0 1.0 L2-4000 UV glass UV glass Synthetic silica UV glass UV glass UV glass Synthetic silica UV glass 185 to 400 185 to 40...ceramic ELECTRODE (REAR PIECE) ceramic ELECTRODE (CENTER PIECE) APERTURE 15.00.5 40 1.0 ANODE ...
Description The best light source is supported by the best electrode technology 最好的光源是支持最好的电极技
XTAL CER SMT 6X3.5 2PAD

File Size 1,116.84K  /  7 Page

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    CMS1006 CMS10 CMS10-06

Toshiba Semiconductor
Toshiba Corporation
Part No. CMS1006 CMS10 CMS10-06
OCR Text ... Note 1: Device mounted on a glass-epoxy board (board size: 50 mm x 50 mm, soldering land: 6 mm x 6 mm) Weight: 0.023 g (typ.) Note 2:...ceramic board (soldering land: 2 mm x 2 mm) Thermal resistance Rth (j-a) Device mounted on a glass-e...
Description Zener Diode; Application: General; Pd (mW): 400; Vz (V): 13.8 to 14.3; Condition Iz at Vz (mA): 5; C (pF) max: -; Condition VR at C (V): &#160; ESD (kV) min: -; Package: MHD
Switching Mode Power Supply Applications
Zener Diode; Application: General; Pd (mW): 400; Vz (V): 13.5 to 14.0; Condition Iz at Vz (mA): 5; C (pF) max: -; Condition VR at C (V):   ESD
Zener Diode; Application: General; Pd (mW): 400; Vz (V): 13.8 to 14.3; Condition Iz at Vz (mA): 5; C (pF) max: -; Condition VR at C (V):   ESD (kV) min: -; Package: MHD

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    CMH08

Toshiba Corporation
Toshiba Semiconductor
Part No. CMH08
OCR Text ...) Rth (j-a) Device mounted on a glass-epoxy board (board size: 50 mm x 50 mm) (soldering land: 6 mm x 6 mm) (board thickness: 1.6 t) Device ...ceramic board: board size: 50 mm x 50 mm Soldering land: 2.0 mm x 2.0 mm board thickness: 0.64 t 0.0...
Description Zener Diode; Application: General; Pd (mW): 400; Vz (V): 11.9 to 12.4; Condition Iz at Vz (mA): 5; C (pF) max: -; Condition VR at C (V):   ESD
Switching Mode Power Supply Applications

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    CMH07

Toshiba Corporation
Toshiba Semiconductor
Part No. CMH07
OCR Text ... 50 mm soldering land: 2mm x2mm glass-epoxy board thickness 0.64 t JEDEC JEITA Note2: TOSHIBA 3-4E1A Using continuously under ...ceramic board (board size: 50 mm x 50 mm) (soldering land: 2 mm x 2 mm) (board thickness: 0.64 t) Th...
Description Zener Diode; Application: General; Pd (mW): 400; Vz (V): 11.6 to 12.1; Condition Iz at Vz (mA): 5; C (pF) max: -; Condition VR at C (V):   ESD
Switching Mode Power Supply Applications

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    CMH05A

Toshiba Semiconductor
Part No. CMH05A
OCR Text ...) Rth (j-a) Device mounted on a glass-epoxy board (board size: 50 mm x 50 mm) (soldering land: 6 mm x 6 mm) (board thickness: 1.6 t) Device ...ceramic board: board size: 50 mm x 50 mm Soldering land: 2.0 mm x 2.0 mm board thickness: 0.64 t 0.0...
Description Switching Mode Power Supply Applications

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    CMH04

Toshiba Corporation
Toshiba Semiconductor
Part No. CMH04
OCR Text ...e 1: Ta=26C Device mounted on a glass-epoxy board board size: 50 mm x 50 mm soldering land: 6 mm x6 mm glass-epoxy board thickness: 1.6 t ...ceramic board (board size: 50 mm x 50 mm) (soldering land: 2 mm x 2 mm) (board thickness: 0.64 t) Th...
Description Zener Diode; Application: General; Pd (mW): 400; Vz (V): 11.4 to 11.9; Condition Iz at Vz (mA): 5; C (pF) max: -; Condition VR at C (V):   ESD
Switching Mode Power Supply Applications

File Size 192.39K  /  5 Page

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For glass ceramic Found Datasheets File :: 3351    Search Time::1.734ms    
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