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Mosel Vitelic, Corp.
Mosel Vitelic Corp
MOSEL[Mosel Vitelic, Corp]
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| Part No. |
V826632K24S
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| OCR Text |
...set information (may be used in future) SDRAM device minimum active to active/auto-refresh time (=tRC) SDRAM device minimum active to autorefresh to active/auto-refresh time (=tRFC ) SDRAM device maximum device cycle time (=tCK MAX) SDRAM d... |
| Description |
2.5 VOLT 32M x 64 HIGH PERFORMANCE UNBUFFERED DDR SDRAM MODULE
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| File Size |
106.84K /
14 Page |
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it Online |
Download Datasheet
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Mosel Vitelic Corp
Mosel Vitelic Corp
MOSEL[Mosel Vitelic, Corp]
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| Part No. |
V82658B04S
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| OCR Text |
...set information (may be used in future) SDRAM device minimum active to active/auto-refresh time (=tRC ) SDRAM device minimum active to autorefresh to active/auto-refresh time (=tRFC) SDRAM device maximum device cycle time (=tCK MAX) SDRAM d... |
| Description |
64 MB 200-PIN DDR UNBUFFERED SODIMM 2.5 VOLT 8M x 64
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| File Size |
123.82K /
14 Page |
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it Online |
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Samsung Electronics
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| Part No. |
CL05C1R5BBNC
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| OCR Text |
...g Control Code 10 Reserved For future Use 11 Packaging Type
1 PRODUCT ABBREVIATION Symbol CL Product Abbreviation SAMSUNG Multilayer Ceramic Chip Capacitor
2 SIZE(mm) Symbol 03 05 Size(mm) Length 0.6 1.0 Width 0.3 0.5
-7-
Mu... |
| Description |
(CL Series) Multilayer Ceramic Capacitor
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| File Size |
545.15K /
29 Page |
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it Online |
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INFINEON[Infineon Technologies AG]
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| Part No. |
V23833-G2005-A101 V23833-G6005-A101 V23833-G6005-A111
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| OCR Text |
... 50 51 Description Reserved For future Use Reserved For future Use Module XAUI Input Lane 3- Module XAUI Input Lane 3+ Module XAUI Input Lane 2- Module XAUI Input Lane 2+ Module XAUI Input Lane 1- Module XAUI Input Lane 1+ Module XAUI Input... |
| Description |
XPAK 850 nm Module 10 Gigabit Pluggable Transceiver Compatible with XPAK MSA Rev. 2.3
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| File Size |
622.40K /
27 Page |
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it Online |
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Mosel Vitelic Corp
Mosel Vitelic, Corp.
Mosel Vitelic Corp
MOSEL[Mosel Vitelic, Corp]
http://
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| Part No. |
V826664G24S
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| OCR Text |
...set information (may be used in future) SDRAM device minimum active to active/auto-refresh time (=tRC) SDRAM device minimum active to autorefresh to active/auto-refresh time (=tRFC ) SDRAM device maximum device cycle time (=tCK MAX) SDRAM d... |
| Description |
512 MB 200-PIN DDR UNBUFFERED SODIMM 2.5 VOLT 64M x 64
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| File Size |
136.00K /
14 Page |
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it Online |
Download Datasheet |
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Mosel Vitelic Corp
Mosel Vitelic Corp
MOSEL[Mosel Vitelic, Corp]
|
| Part No. |
V826664K24S
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| OCR Text |
...set information (may be used in future) SDRAM device minimum active to active/auto-refresh time (=tRC ) SDRAM device minimum active to autorefresh to active/auto-refresh time (=tRFC) SDRAM device maximum device cycle time (=tCK MAX) SDRAM d... |
| Description |
2.5 VOLT 64M x 64 HIGH PERFORMANCE UNBUFFERED DDR SDRAM MODULE
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| File Size |
189.05K /
14 Page |
View
it Online |
Download Datasheet |
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DALLAS[Dallas Semiconductor]
DALLAS[Dallas Semiconducotr]
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| Part No. |
DS1615 DS1615S DS1615X
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| OCR Text |
...and 192 and up are reserved for future extensions. The end user can write only to the Real Time Clock and Control registers and the User NV RAM. The rest of the memory map is read-only from the end users perspective.
4 of 24
DS1615
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| Description |
Temperature Recorder
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| File Size |
197.23K /
24 Page |
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it Online |
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