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EMC[ELAN Microelectronics Corp]
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Part No. |
EM65168 EM65168H EM65168AH
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OCR Text |
...Bare chip (Aluminum pad without bumped); GH: Gold bumped chip; F: COF package; T: TAB (TCP) package Example EM65168H EM65168: Elan number ; H: Bare chip
3.
Application
Data Bank LCD toy Education computer
4
The information in t... |
Description |
80 COM/SEG LCD DRIVER
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File Size |
186.99K /
30 Page |
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it Online |
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意法半导
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Part No. |
STE2002DIE2 STE2002DIE1
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OCR Text |
...ontroller. type ordering number bumped wafers ste2002die1 bumped dice on waffle pack ste2002die2 81 x 128 single chip lcd controller / driver figure 1. block diagram column drivers row drivers data latches 104 x 128 ram display control logi... |
Description |
0.5mm Pitch DIL Vertical SMT Female Assembly, 1.5mm height, location pegs, hold-down tabs, tin, 15 15-way, Tape & Reel packing 81 X 128 SINGLE CHIP LCD CONTROLLER / DRIVER
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File Size |
501.68K /
51 Page |
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it Online |
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ST Microelectronics
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Part No. |
XRAG2
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OCR Text |
...n unbumped wafers or sawn and bumped wafers www.st.com
1 summary description xrag2 2/8 1 summary description the xrag2 is a full-featured, low-cost integrated circuit for use in radio frequency identification (rfid) transponders... |
Description |
Contactless Memory Chip 432 bit
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File Size |
87.47K /
8 Page |
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it Online |
Download Datasheet
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SAMSUNG SEMICONDUCTOR CO. LTD.
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Part No. |
S6B0796
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OCR Text |
...o 244 289 to 292 76 73 bumped pad size 245 to 288 58 76 bumped pad height 1 to 292 14 ( typ.) m m
s 6b 0796 preliminary spec. ver. 1.0 240 seg / ... |
Description |
240 SEG / COM DRIVER FOR STN LCD
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File Size |
281.54K /
32 Page |
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it Online |
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Microchip Technology Inc.
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Part No. |
DV103001 DV103002 DV103003
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OCR Text |
...ro id devices are available in bumped or bondable wafer format which makes them suitable for smart labels and flip-chip style assembly. package options include: die, wafer, wafer-on- frame, bumped wafer-on-frame, pdip, soic and cob modules... |
Description |
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File Size |
198.81K /
2 Page |
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it Online |
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Price and Availability
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