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Amphenol Communications Solutions |
| Part No. |
G832MB130603322HR
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| Description |
0.80mm Board-to-Board 85Ω Connector, Pitch 0.8mm, Height 5.7 mm, 60 Positions, Dual Row, BTB Vertical Plug SMT, 8u\\ Gold White.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
75757-1401 0757571401
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| Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 20 Circuits, 1.5μm (60μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length, 3.05mm (.120) PC Tail Length
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 20 Circuits, 1.5μm (60μ) Tin (Sn) Plating, 11.20mm (.441) Mating Pin Length, 3.05mm (.120) PC Tail Length
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| File Size |
166.40K /
4 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
76350-803-32LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right Angle Header, Through Hole, Double row , 32 Positions, 2.54mm (0.100in) Pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68033-211HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 11 Positions, 2.54 mm Pitch, Vertical, 3.42 mm (0.135in) Mating, 12.01 mm (0.473in) Tail.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
75757-0322 0757570322
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| Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 2 Circuits, 1.25μm (50μ)Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 2 Circuits, 1.25μm (50μ)Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
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| File Size |
98.95K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
68033-226HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 26 Positions, 2.54 mm Pitch, Vertical, 3.42 mm (0.135in) Mating, 12.01 mm (0.473in) Tail.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68033-224HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 24 Positions, 2.54 mm Pitch, Vertical, 3.42 mm (0.135in) Mating, 12.01 mm (0.473in) Tail.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
75757-0341 0757570341
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| Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 4 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 4 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
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| File Size |
99.21K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
68033-232HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 32 Positions, 2.54 mm Pitch, Vertical, 3.42 mm (0.135in) Mating, 12.01 mm (0.473in) Tail.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
75757-0331 0757570331
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| Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 3 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 3 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
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| File Size |
99.21K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
93690-103-32LF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Press Fit, Double Row, 32 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
75757-0352 0757570352
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| Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 5 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 5 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 2.50μm (100μ) Minimum Select Matte Tin (Sn) Plating on Tail
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| File Size |
99.22K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
77317-103-32LF
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| Description |
BergStik®, Board to Board connector, Unshrouded Right angle Header, Through Hole, Double Row, 32 Positions ,2.54mm (0.100in) Pitch,
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
75757-0421 0757570421
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| Description |
3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 2 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 1.50μm (60μ) Minimum Select Matte Tin (Sn) Plating Overall
3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 2 Circuits, 1.25μm (50μ) Nickel (Ni) Overall, 1.50μm (60μ) Minimum Select Matte Tin (Sn) Plating Overall
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| File Size |
98.91K /
3 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
68033-201HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 1 Positions, 2.54 mm Pitch, Vertical, 3.42 mm (0.135in) Mating, 12.01 mm (0.473in) Tail.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
G832ME130803322HR
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| Description |
Pitch 0.8mm, Height 5.7 mm, 80 Positions, Dual Row, BTB Vertical Plug SMT, 8u\\ Gold White
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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