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Cooper Bussmann
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Part No. |
6CGL
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OCR Text |
...mm)
0.06" 0.34"
(8.73mm) (1.59mm)
2.80"
(71.04mm)
0.94"
(23.81mm)
3.31"
(84.14mm)
CGL 1-30 0.22" 0.22" 0.81"
(20.64mm)
(5.56mm) (5.56mm)
2.0"
(50.8mm)
0.06" 0.50"
(12.7mm) (1.59mm)
2.80"
(71.04mm)
1.06"... |
Description |
6A:600V:Current Limiting
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File Size |
43.62K /
3 Page |
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it Online |
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![1N6626D3A 1N6626D3B 1N6626D3A-JQRS.GRPB 1N6626D3B-JQRS.GRPB 1N6626D3B-JQRS.GRPC 1N6626D3A-JQRS.GRPC](Maker_logo/seme_lab.GIF)
Seme LAB TT electronics Semelab, Ltd.
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Part No. |
1N6626D3A 1N6626D3B 1N6626D3A-JQRS.GRPB 1N6626D3B-JQRS.GRPB 1N6626D3B-JQRS.GRPC 1N6626D3A-JQRS.GRPC
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OCR Text |
.... (3) PCB = FR4, 0.0625 Inch (1.59mm) thick, single layer, 1.0-Oz Cu, Pad Size, (1.0" x 1.0"), (645mm x 645mm) , horizontal in still air. (4) PCB = FR4, 0.0625 Inch (1.59mm) thick, single layer, 1.0-Oz Cu, Pad Size, (0.070" x 0.155"), (1.78... |
Description |
ULTRA FAST RECOVERY POWER RECTIFIER 1.75 A, 200 V, SILICON, RECTIFIER DIODE CERAMIC, DLCC3 VARIANT A, 2 PIN 1.75 A, 200 V, SILICON, RECTIFIER DIODE CERAMIC, DLCC3 VARIANT B, 2 PIN
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File Size |
274.52K /
4 Page |
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AVAGO TECHNOLOGIES LIMI...
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Part No. |
HLMP-EG55
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OCR Text |
...ing irons tip) to the body is 1.59mm. note: 1. pcb with diferent size and design (component density) will have diferent heat mass (heat capacity). this might cause a change in temperature experienced by the board if same wave soldering... |
Description |
T-13/4 (5 mm) Precision Optical Performance AlInGaP LED Lamps
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File Size |
204.20K /
10 Page |
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it Online |
Download Datasheet
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