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  44474-1841 Datasheet PDF File

For 44474-1841 Found Datasheets File :: 146+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |   

   
Part No. CYM1841CP7-45C CYM1841CPM-45C CYM1841CPZ-45C CYM1841CP7-20C
Description x32 SRAM Module X32号的SRAM模块

File Size 446.58K  /  10 Page

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Amphenol Communications Solutions

Part No. 91618-416LF
Description Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Vertical, Surface Mount, Double row, Top Entry, 32 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

HUA FENG CIRCUIT





   
Part No. CYM1841LPN-35C CYM1841LPZ-35C CYM1841LPZ-55C CYM1841LPN-55C CYM1841LPM-55C CYM1841LPM-35C CYM1841LPZ-45C CYM1841LPM-45C CYM1841LPN-45C
Description x32 SRAM Module

File Size 511.38K  /  6 Page

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Amphenol Communications Solutions

Part No. 68418-418HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 18 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 10.16 mm (0.4 in.) Tail
Tech specs    

Official Product Page

    Sony, Corp.
Part No. CXK77B1841GB
Description 4Mb Late Write LVTTL High Speed Synchronous SRAM (256K x 18Bit)(4M位、写延迟LVTTL高速同步静态RAM (256K x 18) 4Mb的后写入LVTTL高速同步SRAM56 × 18位)分位,写延迟LVTTL高速同步静态随机存储器56 × 18位)

File Size 203.86K  /  22 Page

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Amphenol Communications Solutions

Part No. 131-8414-21H
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 4 Column, Right End Wall, Backplane Module, 2.25mm Wipe, APP.
Tech specs    

Official Product Page

   
Part No. CXK77B1841GB-45
Description 256K X 18 LATE-WRITE SRAM, 5.5 ns, PBGA119

File Size 808.10K  /  22 Page

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Amphenol Communications Solutions

Part No. 91618-414LF
Description Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Vertical, Surface Mount, Double row, Top Entry, 28 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    Sony
Part No. CXK77B1841GB
Description 4Mb Late Write LVTTL High Speed Synchronous SRAM (256K x 18 Organization)
From old datasheet system

File Size 199.01K  /  22 Page

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Amphenol Communications Solutions

Part No. 68418-419HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 19 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 10.16 mm (0.4 in.) Tail
Tech specs    

Official Product Page

    CYPRESS SEMICONDUCTOR CORP
Part No. CYM1841V33PZ-25C
Description 256K X 32 MULTI DEVICE SRAM MODULE, 25 ns, PZMA64

File Size 132.95K  /  7 Page

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Amphenol Communications Solutions

Part No. 89891-841H
Description Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Dual Entry , 82 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    60711A102 011184191

Molex Electronics Ltd.
Part No. 60711A102 011184191
Description Combination Anvil

File Size 11.60K  /  1 Page

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Amphenol Communications Solutions

Part No. 131-8416-11H
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 6 Column, Right End Wall, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

   
Part No. CYM1841V33PZ-35C
Description x32 SRAM Module

File Size 205.42K  /  7 Page

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Amphenol Communications Solutions

Part No. 71918-414LF
Description Quickie Eject Latch Shrouded Header, Through Hole, Vertical, Double Row, 14 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    Cypress Semiconductor, Corp.
Part No. CYM1841BPZ-20C CYM1841BPZ-45C CYM1841BP7-15C CYM1841BPM-20C CYM1841BPZ-25C CYM1841BPZ-15C CYM1841BP7-20C CYM1841BPM-25C CYM1841BPM-15C CYM1841BPM-45C CYM1841BPM-35C
Description 256K X 32 MULTI DEVICE SRAM MODULE, 35 ns, SMA64 PLASTIC, SIMM-64
256K X 32 MULTI DEVICE SRAM MODULE, 45 ns, SMA64 PLASTIC, SIMM-64
256K X 32 MULTI DEVICE SRAM MODULE, 15 ns, SMA64 PLASTIC, SIMM-64
256K X 32 MULTI DEVICE SRAM MODULE, 25 ns, SMA64 PLASTIC, SIMM-64
256K X 32 MULTI DEVICE SRAM MODULE, 20 ns, SMA72 PLASTIC, SIMM-72
256K x 32 Static RAM Module

File Size 89.49K  /  9 Page

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Amphenol Communications Solutions

Part No. 91618-419LF
Description Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Vertical, Surface Mount, Double row, Top Entry, 38 Positions, 2.54mm (0.100in) Pitch
Tech specs    

Official Product Page

    L-com, Inc.
Part No. CYM1841APZ-55C CYM1841P7-20C CYM1841PM-30C
Description x32 SRAM Module X32号的SRAM模块

File Size 387.02K  /  9 Page

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Amphenol Communications Solutions

Part No. 68418-417HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 17 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 10.16 mm (0.4 in.) Tail
Tech specs    

Official Product Page

For 44474-1841 Found Datasheets File :: 146+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | <10> | 11 | 12 | 13 | 14 | 15 |   

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