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Amphenol Communications Solutions |
| Part No. |
91618-416LF
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| Description |
Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Vertical, Surface Mount, Double row, Top Entry, 32 Positions, 2.54mm (0.100in) Pitch
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68418-418HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 18 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 10.16 mm (0.4 in.) Tail
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Official Product Page
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Sony, Corp.
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| Part No. |
CXK77B1841GB
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| Description |
4Mb Late Write LVTTL High Speed Synchronous SRAM (256K x 18Bit)(4M位、写延迟LVTTL高速同步静态RAM (256K x 18) 4Mb的后写入LVTTL高速同步SRAM56 × 18位)分位,写延迟LVTTL高速同步静态随机存储器56 × 18位)
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| File Size |
203.86K /
22 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
131-8414-21H
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| Description |
Paladin® 112Gb/s Backplane Connector, 8-Pair, 4 Column, Right End Wall, Backplane Module, 2.25mm Wipe, APP.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
91618-414LF
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| Description |
Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Vertical, Surface Mount, Double row, Top Entry, 28 Positions, 2.54mm (0.100in) Pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68418-419HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 19 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 10.16 mm (0.4 in.) Tail
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
89891-841H
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| Description |
Dubox®, Board To Board Connector, Receptacle, Vertical, Through Hole, Double Row, Dual Entry , 82 Positions, 2.54mm (0.100in) Pitch
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
131-8416-11H
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| Description |
Paladin® 112Gb/s Backplane Connector, 8-Pair, 6 Column, Right End Wall, Backplane Module, 1.5mm Wipe, APP.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
71918-414LF
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| Description |
Quickie Eject Latch Shrouded Header, Through Hole, Vertical, Double Row, 14 Positions, 2.54mm (0.100in) Pitch
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Official Product Page
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Cypress Semiconductor, Corp.
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| Part No. |
CYM1841BPZ-20C CYM1841BPZ-45C CYM1841BP7-15C CYM1841BPM-20C CYM1841BPZ-25C CYM1841BPZ-15C CYM1841BP7-20C CYM1841BPM-25C CYM1841BPM-15C CYM1841BPM-45C CYM1841BPM-35C
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| Description |
256K X 32 MULTI DEVICE SRAM MODULE, 35 ns, SMA64 PLASTIC, SIMM-64 256K X 32 MULTI DEVICE SRAM MODULE, 45 ns, SMA64 PLASTIC, SIMM-64 256K X 32 MULTI DEVICE SRAM MODULE, 15 ns, SMA64 PLASTIC, SIMM-64 256K X 32 MULTI DEVICE SRAM MODULE, 25 ns, SMA64 PLASTIC, SIMM-64 256K X 32 MULTI DEVICE SRAM MODULE, 20 ns, SMA72 PLASTIC, SIMM-72 256K x 32 Static RAM Module
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| File Size |
89.49K /
9 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
91618-419LF
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| Description |
Dubox® 2.54mm, Board to Board Connector, PCB Mounted Receptacle, Vertical, Surface Mount, Double row, Top Entry, 38 Positions, 2.54mm (0.100in) Pitch
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68418-417HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 17 Positions, 2.54 mm Pitch, Vertical, 5.84 mm (0.23 in.) Mating, 10.16 mm (0.4 in.) Tail
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| Tech specs |
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Official Product Page
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