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  42051-164 Datasheet PDF File

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    3-1000Z 8164/3-1000Z

List of Unclassifed Manufacturers
Part No. 3-1000Z 8164/3-1000Z
Description HIGH-MU POWER TRIODE

File Size 440.55K  /  4 Page

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Amphenol Communications Solutions

Part No. 10155242-05111LF
Description Minitek® 1.25mm Latch,1.25mm Crimp-to-Wire Connector Platform, Wire to Board Header, 5 Position., Top Latch, Tin (preplated)
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    Molex, Inc.
Part No. 19164-0042
Description Female Disconnect Solderless Terminal; Wire Size (AWG):14-16; Terminal Insulation:Niac Polymer; Contact Material:Brass; Gender:Female; Power Connection Type:Female Disconnect Solderless Terminal 2 mm2, WIRE TERMINAL

File Size 119.02K  /  1 Page

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    74164-0168

Molex Electronics Ltd.
Part No. 74164-0168
Description 2.54mm (.100") Pitch C-Grid垄莽 Receptacle, Right Angle, Through Hole, Dual RowShrouded with Pegs High-Temperature, 68 Circuits, Tin (Sn)

File Size 392.76K  /  4 Page

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    42225-0164 A-42225-0164

Molex Electronics Ltd.
Part No. 42225-0164 A-42225-0164
Description 2.54mm (.100) Pitch KK? Header, Breakaway, Vertical, with Polarizing Wall, 24 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, with Kinked PC Tails

File Size 190.46K  /  8 Page

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    74164-0122

Molex Electronics Ltd.
Part No. 74164-0122
Description 2.54mm (.100) Pitch C-Grid? Receptacle, Right Angle, Through Hole, Dual Row, Shrouded with Pegs High-Temperature, 22 Circuits, Tin (Sn)

File Size 392.43K  /  4 Page

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    74164-0118

Molex Electronics Ltd.
Part No. 74164-0118
Description 2.54mm (.100) Pitch C-Grid? Receptacle, Right Angle, Through Hole, Dual Row,Shrouded with Pegs High-Temperature, 18 Circuits, Tin (Sn)

File Size 392.43K  /  4 Page

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    90571-1642

Molex Electronics Ltd.
Part No. 90571-1642
Description 2.54mm (.100) Pitch QF-50?/a> Header, Vertical, Dual Row, Shrouded, DIN Keying, with Latch/Eject Levers, 64 Circuits, 0.76 μm Gold (Au)

File Size 274.79K  /  4 Page

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    HDMP-1636 HDMP-1646

Dantona Industries, Inc.
HP[Agilent(Hewlett-Packard)]
Agilent (Hewlett-Packard)
Part No. HDMP-1636 HDMP-1646
Description Gigabit Ethernet Transceiver Chip 千兆以太网收发器芯片
Software

File Size 314.09K  /  15 Page

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    74164-0116

Molex Electronics Ltd.
Part No. 74164-0116
Description 2.54mm (.100) Pitch C-Grid Receptacle, Right Angle, Through Hole, Dual Row, Shrouded with Pegs

File Size 392.43K  /  4 Page

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    71439-1164

Molex Electronics Ltd.
Part No. 71439-1164
Description 1.00mm (.039) Pitch Mezzanine IEEE 1386 Receptacle, Surface Mount, Dual Row,Vertical Stacking, Tube, 0.76μm (30μ) Gold (Au), 64 Circuits

File Size 302.99K  /  4 Page

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